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| Ambient noise as the new source for urban engineering seismology and earthquake engineering: a case study from Beijing metropolitan area |
| Lanbo Liu1,2, Qi-fu Chen3, Weijun Wang2, Eric Rohrbach1 |
1 Department of Civil & Environmental Engineering, University of Connecticut, Storrs, CT 06269, USA
2 Institute of Earthquake Science, China Earthquake Administration, Beijing 100036, China
3 Institute of Geology and Geophysics, Chinese Academy of Sciences, Beijing 100083, China |
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Abstract In highly populated urban centers, traditional seismic survey sources can no longer be properly applied due to restrictions in modern civilian life styles. The ambient vibration noise, including both microseisms and microtremor, though are generally weak but available anywhere and anytime, can be an ideal supplementary source for conducting seismic surveys for engineering seismology and earthquake engineering. This is fundamentally supported by advanced digital signal processing techniques for effectively extracting the useful information out from the noise. Thus, it can be essentially regarded as a passive seismic method. In this paper we first make a brief survey of the ambient vibration noise, followed by a quick summary of digital signal processing for passive seismic surveys. Then the applications of ambient noise in engineering seismology and earthquake engineering for urban settings are illustrated with examples from Beijing metropolitan area. For engineering seismology the example is the assessment of site effect in a large area via microtremor observations. For earthquake engineering the example is for structural characterization of a typical reinforced concrete high-rise building using background vibration noise. By showing these examples we argue that the ambient noise can be treated as a new source that is economical, practical, and particularly valuable to engineering seismology and earthquake engineering projects for seismic hazard mitigation in urban areas.
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Received: 08 September 2013
Published: 08 January 2014
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Corresponding Authors:
Lanbo Liu
E-mail: Lanbo.Liu@UConn.edu
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